CPC H05K 5/0217 (2013.01) [B22D 19/04 (2013.01); B22D 19/14 (2013.01); B29C 33/38 (2013.01); B29C 35/02 (2013.01); B29C 45/14311 (2013.01); B29C 70/72 (2013.01); H05K 5/0208 (2013.01); B29C 2035/0827 (2013.01); B29C 2035/0877 (2013.01); B29K 2105/16 (2013.01); B29L 2031/3437 (2013.01); B29L 2031/3481 (2013.01); H04M 1/0202 (2013.01); H05K 5/0086 (2013.01); H05K 5/04 (2013.01)] | 15 Claims |
1. A housing of an electronic device, comprising:
a monolithic substrate formed of a moldable polymer material having a uniform composition and defining:
an external surface and an internal surface of the housing;
a back panel; and
a set of sidewalls extending from the back panel and defining a curved corner portion of the monolithic substrate; and
a plurality of members bonded directly to the monolithic substrate in respective recesses defined in the monolithic substrate, the plurality of members protruding from the external surface and having a hardness greater than a hardness of the monolithic substrate, the plurality of members comprising:
a first set of members protruding from the external surface along the curved corner portion, the first set of members defining a first surface density, each member of the first set of members retained to the monolithic substrate at least in part by a respective undercut defined by the monolithic substrate and in contact with a surface of the member of the first set; and
a second set of members protruding from the external surface along the back panel, the second set of members defining a second surface density, less than the first surface density, and each member of the second set of members retained to the monolithic substrate at least in part by a respective undercut defined by the monolithic substrate and in contact with a surface of the member of the second set.
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