US 11,678,104 B2
Headphone sealing cup
Anders Røser Hansen, Ballerup (DK); Peter Vestergaard Værum, Ballerup (DK); Klaus Sommer Ipsen, Vanløse (DK); Johan Grundtvig, Brønshøj (DK); Morten Hessilt Kjær, Ballerup (DK); and Giovanni Ferranti, Ballerup (DK)
Assigned to EPOS Group A/S, Ballerup (DK)
Filed by EPOS Group A/S, Ballerup (DK)
Filed on Sep. 29, 2021, as Appl. No. 17/488,808.
Claims priority of application No. 20199138 (EP), filed on Sep. 30, 2020.
Prior Publication US 2022/0103931 A1, Mar. 31, 2022
Int. Cl. H04R 1/28 (2006.01); H04R 1/10 (2006.01)
CPC H04R 1/1083 (2013.01) [H04R 1/1008 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An earcup for a headphone, comprising:
a front opening adapted to be adjacent to the ear of a user of the headphone,
a baffle disposed within the earcup to define a front cavity and a rear cavity;
an outer cup arranged to accommodate the rear cavity,
a first inner cup arranged within the rear cavity surrounding the front opening,
a transducer; and
an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user,
wherein the earcup comprises a second inner cup arranged between the outer cup and the first inner cup, wherein the second inner cup is configured as an acoustic barrier between outside noise and the ear of the user, and
wherein a back wall of the first inner cup is spaced apart from a back wall of the second inner cup.