US 11,678,043 B2
Sensor module with a collar
Russell Gruhlke, San Jose, CA (US); Jon Lasiter, Stockton, CA (US); Ravindra Vaman Shenoy, Dublin, CA (US); Ravishankar Sivalingam, San Jose, CA (US); Kebin Li, Fremont, CA (US); and Khurshid Syed Alam, Mountain View, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Sep. 3, 2021, as Appl. No. 17/446,895.
Application 17/446,895 is a continuation of application No. 16/521,222, filed on Jul. 24, 2019, granted, now 11,115,576.
Claims priority of provisional application 62/826,667, filed on Mar. 29, 2019.
Prior Publication US 2021/0400178 A1, Dec. 23, 2021
Int. Cl. H04N 5/225 (2006.01); H04N 23/57 (2023.01); H04N 23/60 (2023.01); H04M 1/02 (2006.01)
CPC H04N 23/57 (2023.01) [H04N 23/60 (2023.01); G03H 2227/02 (2013.01); H04M 1/0202 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sensor module comprising:
a collar configured to be attached to a camera module for a user device,
wherein the collar includes:
a first opening that is configured to align with an aperture of a camera of the camera module, and
a second opening;
a sensor attachment module in the collar;
a sensor within the sensor attachment module,
wherein the sensor is in an offset position relative to an axis associated with the sensor module; and
a reflective device configured to redirect a field of view of the sensor through the aperture.