US 11,677,478 B2
Method for co-packaging light engine chiplets on switch substrate
Radhakrishnan L. Nagarajan, Santa Clara, CA (US); Liang Ding, Singapore (SG); Mark Patterson, Santa Clara, CA (US); Roberto Coccioli, Santa Clara, CA (US); and Steve Aboagye, Santa Clara, CA (US)
Assigned to MARVELL ASIA PTE LTD, Singapore (SG)
Filed by MARVELL ASIA PTE, LTD., Singapore (SG)
Filed on Aug. 10, 2021, as Appl. No. 17/398,481.
Application 17/398,481 is a continuation of application No. 16/894,622, filed on Jun. 5, 2020, granted, now 11,165,509.
Prior Publication US 2021/0384989 A1, Dec. 9, 2021
Int. Cl. H04B 10/40 (2013.01); H04B 10/80 (2013.01); H04J 14/02 (2006.01); H01L 23/538 (2006.01); H04B 10/50 (2013.01)
CPC H04B 10/801 (2013.01) [H01L 23/5384 (2013.01); H04B 10/40 (2013.01); H04B 10/503 (2013.01); H04J 14/0278 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A co-packaged optical module comprising:
a substrate;
a processor arranged on the substrate; and
a plurality of light engines mounted around the processor on the substrate using mounting assemblies configured to attach the respective light engines to the substrate, the light engines and the mounting assemblies disposed along a perimeter of the substrate, including at corners of the substrate;
each of the mounting assemblies comprising a socket, a clamp clamping a corresponding one of the light engines into the socket, and a plurality of alignment pins for mechanically aligning the socket to a predefined location on the substrate, which alignment pins when mated with corresponding holes in the substrate cause peripheries of the mounting assemblies, including the light engines, the sockets and the clamps, to be flush with the perimeter of the substrate, and to cover the entire perimeter of the substrate end to end including at the corners of the substrate.