US 11,677,377 B2
Multi-layer piezoelectric substrate with grounding structure
Rei Goto, Osaka (JP); and Keiichi Maki, Suita (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Dec. 20, 2019, as Appl. No. 16/723,714.
Claims priority of provisional application 62/785,011, filed on Dec. 26, 2018.
Prior Publication US 2020/0212875 A1, Jul. 2, 2020
Int. Cl. H03H 9/02 (2006.01); H03H 9/54 (2006.01); H01L 41/047 (2006.01); H03H 9/13 (2006.01); H01L 41/27 (2013.01); H01L 41/083 (2006.01); H03H 3/08 (2006.01); H03H 9/64 (2006.01); H03H 9/72 (2006.01)
CPC H03H 9/02913 (2013.01) [H01L 41/047 (2013.01); H01L 41/083 (2013.01); H01L 41/27 (2013.01); H03H 3/08 (2013.01); H03H 9/02559 (2013.01); H03H 9/02574 (2013.01); H03H 9/02834 (2013.01); H03H 9/131 (2013.01); H03H 9/54 (2013.01); H03H 9/6406 (2013.01); H03H 9/725 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave device comprising:
a piezoelectric layer over a substrate;
an interdigital transducer electrode over the piezoelectric layer;
a grounding structure over the piezoelectric layer; and
a conductive layer positioned vertically between the piezoelectric layer and the substrate, the conductive layer being electrically connected to the grounding structure, the interdigital transducer electrode vertically overlapping at least a portion of the conductive layer.