US 11,677,032 B2
Sensor integrated circuit with integrated coil and element in central region of mold material
Ravi Vig, Concord, NH (US); William P. Taylor, Amherst, NH (US); Paul A. David, Bow, NH (US); P. Karl Scheller, Dover, NH (US); and Andreas P. Friedrich, Metz-Tessy (FR)
Assigned to Allegro MicroSystems, LLC, Manchester, NH (US)
Filed by Allegro MicroSystems, LLC, Manchester, NH (US)
Filed on Jun. 14, 2022, as Appl. No. 17/806,758.
Application 17/806,758 is a division of application No. 17/130,085, filed on Dec. 22, 2020, granted, now 11,444,209.
Application 17/130,085 is a division of application No. 16/252,789, filed on Jan. 21, 2019, granted, now 10,916,665, issued on Feb. 9, 2021.
Application 16/252,789 is a division of application No. 15/618,251, filed on Jun. 9, 2017, granted, now 10,230,006, issued on Mar. 12, 2019.
Application 15/618,251 is a division of application No. 13/748,999, filed on Jan. 24, 2013, granted, now 9,812,588, issued on Nov. 7, 2017.
Application 13/748,999 is a continuation in part of application No. 13/424,618, filed on Mar. 20, 2012, granted, now 10,234,513, issued on Mar. 19, 2019.
Prior Publication US 2022/0310853 A1, Sep. 29, 2022
Int. Cl. H01L 29/82 (2006.01); G01R 33/06 (2006.01); G01R 33/00 (2006.01); G01D 5/14 (2006.01); G01R 15/20 (2006.01)
CPC H01L 29/82 (2013.01) [G01D 5/147 (2013.01); G01R 33/0047 (2013.01); G01R 33/0052 (2013.01); G01R 33/06 (2013.01); G01R 15/207 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00011 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A sensor comprising:
a lead frame having a first surface, a second opposing surface, and a plurality of leads;
a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface;
a non-conductive mold material enclosing the die and at least a portion of the lead frame;
a conductive coil secured to the non-conductive mold material;
a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and the conductive coil is disposed outside the central region; and
an element disposed in the central region of the mold material.