CPC H01L 29/82 (2013.01) [G01D 5/147 (2013.01); G01R 33/0047 (2013.01); G01R 33/0052 (2013.01); G01R 33/06 (2013.01); G01R 15/207 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00011 (2013.01)] | 19 Claims |
1. A sensor comprising:
a lead frame having a first surface, a second opposing surface, and a plurality of leads;
a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface;
a non-conductive mold material enclosing the die and at least a portion of the lead frame;
a conductive coil secured to the non-conductive mold material;
a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and the conductive coil is disposed outside the central region; and
an element disposed in the central region of the mold material.
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