US 11,676,950 B2
Via-in-via structure for high density package integrated inductor
Krishna Bharath, Chandler, AZ (US); Sriram Srinivasan, Chandler, AZ (US); Amruthavalli Alur, Chandler, AZ (US); Kaladhar Radhakrishnan, Chandler, AZ (US); Huong Do, Chandler, AZ (US); and William Lambert, Tempe, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Appl. No. 16/635,147
Filed by INTEL CORPORATION, Santa Clara, CA (US)
PCT Filed Sep. 28, 2017, PCT No. PCT/US2017/054098
§ 371(c)(1), (2) Date Jan. 29, 2020,
PCT Pub. No. WO2019/066868, PCT Pub. Date Apr. 4, 2019.
Prior Publication US 2021/0098436 A1, Apr. 1, 2021
Int. Cl. H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01)
CPC H01L 25/16 (2013.01) [H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a plurality of plated through holes;
a magnetic material within the plurality of plated through holes, wherein the magnetic material is paramagnetic, ferromagnetic, or a Heusler alloy; and
one or more conductors orthogonal to a length of the plurality of plated through holes, the one or more conductors to couple one plated through hole of the plurality with another plated through hole of the plurality such that an inductor is formed.
 
10. A package comprising:
a first die;
a second die coupled to the first die; and
a substrate coupled to the first die, wherein the substrate comprises a plurality of layers of conductive material and dielectric, wherein at least one of the layers of the plurality is adjacent to the substrate, wherein a region of the plurality of layers includes:
a plurality of plated through holes;
a magnetic material within the plurality of plated through holes, wherein the magnetic material is paramagnetic, ferromagnetic, or a Heusler alloy; and
one or more conductors orthogonal to a length of the plurality of plated through holes, the one or more conductors to couple one plated through hole of the plurality with another plated through hole of the plurality such that an inductor is formed.