US 11,676,937 B2
Flexible sinter tool for bonding semiconductor devices
Jiapei Ding, Singapore (SG); Rolan Ocuaman Camba, Singapore (SG); Teng Hock Kuah, Singapore (SG); Jian Liao, Singapore (SG); and Kar Weng Yan, Singapore (SG)
Assigned to ASMPT SINGAPORE PTE. LTD., Singapore (SG)
Filed by ASMPT SINGAPORE PTE, LTD., Singapore (SG)
Filed on May 4, 2021, as Appl. No. 17/307,028.
Prior Publication US 2022/0359459 A1, Nov. 10, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 25/07 (2006.01)
CPC H01L 24/83 (2013.01) [H01L 25/072 (2013.01); H01L 2224/8384 (2013.01)] 18 Claims
OG exemplary drawing
 
1. Apparatus for bonding at least one semiconductor device onto a substrate that is supported on a platform, the apparatus comprising:
a seal plate including rigid hard portions and one or more flexible soft portions located between the hard portions, the seal plate having a first side which is configured to be in contact with the substrate in use when the substrate is supported on the platform;
a diaphragm covering a second side of the seal plate opposite to the first side;
a fluid pressure generator that is in fluid communication with the diaphragm, the fluid pressure generator being operative to exert a fluid pressure onto the diaphragm, the fluid pressure being further operative to actuate the diaphragm to compress the one or more soft portions, whereby to contact the at least one semiconductor device with the one or more soft portions and to apply a bonding force onto the at least one semiconductor device during bonding; and
the seal plate is movable between a first position which is spaced from the substrate, and a second position whereat a first side of the seal plate is configured to be in contact with the substrate in use whereby the fluid pressure is further configured to be applied by the diaphragm onto the hard portions of the seal plate against the substrate.