US 11,676,926 B2
Solder joints on nickel surface finishes without gold plating
Mark Alex Kostinovsky, Houston, TX (US); Steven O. Dunford, Missouri City, TX (US); and Lweness Mazari, Sugar Land, TX (US)
Assigned to Schlumberger Technology Corporation, Sunar Land, TX (US)
Filed by Schlumberger Technology Corporation, Sugar Land, TX (US)
Filed on Aug. 24, 2020, as Appl. No. 17/966.
Prior Publication US 2022/0059489 A1, Feb. 24, 2022
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/16 (2013.01) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 24/89 (2013.01); H01L 2224/03019 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/08502 (2013.01); H01L 2224/11019 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/4312 (2013.01); H01L 2224/43125 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45655 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48506 (2013.01); H01L 2224/80355 (2013.01); H01L 2224/81355 (2013.01); H01L 2224/85355 (2013.01); H01L 2924/15747 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for interconnecting two conductors, comprising:
creating a first nickel layer on a first conductor of an electrical component;
producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from corroding;
creating a second nickel layer on a second conductor;
producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from corroding;
interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors; and
applying a third non-gold protective layer after interconnecting the first and second conductors, to prevent corrosion of the first and second conductors, the first and second nickel layers, or a combination thereof.