CPC H01L 24/16 (2013.01) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 24/89 (2013.01); H01L 2224/03019 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/08502 (2013.01); H01L 2224/11019 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/4312 (2013.01); H01L 2224/43125 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45655 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48506 (2013.01); H01L 2224/80355 (2013.01); H01L 2224/81355 (2013.01); H01L 2224/85355 (2013.01); H01L 2924/15747 (2013.01)] | 12 Claims |
1. A method for interconnecting two conductors, comprising:
creating a first nickel layer on a first conductor of an electrical component;
producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from corroding;
creating a second nickel layer on a second conductor;
producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from corroding;
interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors; and
applying a third non-gold protective layer after interconnecting the first and second conductors, to prevent corrosion of the first and second conductors, the first and second nickel layers, or a combination thereof.
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