CPC H01L 23/16 (2013.01) [H01L 21/52 (2013.01); H01L 23/3675 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 25/0655 (2013.01); H01L 25/165 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/18 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01)] | 17 Claims |
1. A semiconductor package, comprising:
a package substrate including a top surface;
a semiconductor die mounted directly on the package substrate;
an integrated heat spreader mounted on the package substrate, wherein the integrated heat spreader includes a top wall over the semiconductor die and a sidewall between the top wall and the top surface, and wherein the semiconductor die is separated from the sidewall by an overhang gap;
a sealant bridge within the overhang gap between the top wall and the top surface; and
a die side component (DSC) mounted directly on the package substrate within the overhang gap, wherein the sealant bridge is on the DSC and extends between the top wall and the DSC, and wherein the sealant bridge is further on at least a portion of a vertical sidewall of the DSC.
|