US 11,676,833 B2
Protective sheet for use in processing wafer, handling system for wafer, and combination of wafer and protective sheeting
Karl Heinz Priewasser, Munich (DE)
Assigned to DISCO CORPORATION, Tokyo (JP)
Appl. No. 16/613,570
Filed by DISCO Corporation, Tokyo (JP)
PCT Filed May 18, 2017, PCT No. PCT/EP2017/061997
§ 371(c)(1), (2) Date Nov. 14, 2019,
PCT Pub. No. WO2018/210426, PCT Pub. Date Nov. 22, 2018.
Prior Publication US 2020/0373176 A1, Nov. 26, 2020
Int. Cl. H01L 21/67 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/67132 (2013.01) [H01L 21/3043 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01)] 16 Claims
OG exemplary drawing
 
14. A protective sheeting for use in processing a semiconductor-sized wafer, the protective sheeting comprising:
a protective film; and
a cushioning layer attached to a back surface of the protective film, the cushioning layer being curable by an external stimulus so that the cushioning layer hardens at least to some degree upon application of the external stimulus,
wherein, at least in a central area of the protective sheeting, no adhesive is applied to a front surface and a back surface of the protective sheeting, the central area having an outer diameter which is equal to or larger than an outer diameter of the semiconductor-sized wafer, and
a substantially annular adhesive layer is applied to an outer peripheral portion of a front surface of the protective film opposite to the back surface thereof.