US 11,676,829 B2
Hyperbaric saw for sawing packaged devices
Byron Harry Gibbs, Ector, TX (US); and Michael Todd Wyant, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Dec. 31, 2020, as Appl. No. 17/139,072.
Prior Publication US 2022/0208571 A1, Jun. 30, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/67092 (2013.01) [H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/562 (2013.01); H01L 2223/5446 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for packaging electronic devices, comprising:
forming electronic devices on a semiconductor wafer;
separating the electronic devices from one another by cutting through the semiconductor wafer in scribe lanes on the semiconductor wafer between the electronic devices;
mounting the electronic devices on a package substrate, the package substrate carrying an array of electronic devices, the electronic devices spaced from one another on the package substrate by saw streets defined between the electronic devices;
electrically coupling bond pads on the electronic devices to leads on the package substrate;
covering the electronic devices and portions of the package substrate with mold compound;
placing the array of electronic devices on a device chuck in a process chamber;
increasing a pressure in the process chamber to a pressure greater than one atmosphere;
sawing through the mold compound and the package substrate along the saw streets between the electronic devices to separate molded electronic devices one from another; and
removing the molded electronic devices from the process chamber.