US 11,676,757 B2
Electronic component and method of manufacturing electronic component
Shinji Otani, Nagaokakyo (JP); Yuuta Hoshino, Nagaokakyo (JP); Toshihiko Kobayashi, Nagaokakyo (JP); and Tomotaka Gotohda, Nagaokakyo (JP)
Assigned to Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Jul. 15, 2020, as Appl. No. 16/930,093.
Claims priority of application No. JP2019-147659 (JP), filed on Aug. 9, 2019.
Prior Publication US 2021/0043369 A1, Feb. 11, 2021
Int. Cl. H01F 17/04 (2006.01); H01F 27/32 (2006.01); H01F 27/28 (2006.01); H01F 41/061 (2016.01); H01F 27/29 (2006.01); H01F 41/12 (2006.01); H01F 27/24 (2006.01)
CPC H01F 27/32 (2013.01) [H01F 27/24 (2013.01); H01F 27/2823 (2013.01); H01F 27/29 (2013.01); H01F 41/061 (2016.01); H01F 41/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component comprising:
a component body including a core having a winding core part;
an insulating layer that comprises a material having a higher insulating property than the component body and that partially covers a surface of the component body; and
an electrode that is stacked on a surface of the insulating layer;
wherein the electrode includes a base electrode that is stacked on the surface of the insulating layer and a plating layer that is stacked on a surface of the base electrode, and the insulating layer has a larger surface area than the electrode and the electrode is stacked at a position separated from an edge of the insulating layer, the edge of the insulating layer being present along the winding core part of the core at a position spaced from a flange part so that a portion of the winding core part is exposed beginning at the edge of the insulating layer.