US 11,674,063 B2
Epoxy resin adhesive compositions
Felix Koch, Horgen (CH); Andreas Lutz, Horgen (CH); Beda Steiner, Horgen (CH); Cathy Grossnickel, Horgen (CH); and Jeannine Flueckiger, Horgen (CH)
Assigned to DDP Specialty Electronic Materials US, LLC, Wilmington, DE (US)
Appl. No. 16/956,803
Filed by DDP SPECIALTY ELECTRONIC MATERIALS US, LLC, Wilmington, DE (US)
PCT Filed Dec. 7, 2018, PCT No. PCT/US2018/064455
§ 371(c)(1), (2) Date Jun. 22, 2020,
PCT Pub. No. WO2019/135857, PCT Pub. Date Jul. 11, 2019.
Claims priority of provisional application 62/614,660, filed on Jan. 8, 2018.
Prior Publication US 2021/0062054 A1, Mar. 4, 2021
Int. Cl. C09J 163/00 (2006.01); C08G 59/40 (2006.01); B32B 15/092 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); C08K 3/22 (2006.01)
CPC C09J 163/00 (2013.01) [C08K 3/22 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01)] 14 Claims
 
9. A method comprising:
(a) applying a one-component epoxy resin adhesive composition to at least a portion of a one substrate, wherein the one-component epoxy resin adhesive composition comprises:
(i) one or more non-rubber-modified epoxy resins;
(ii) one or more latent epoxy curing agents, wherein the one or more latent epoxy curing agents comprises a dicyanamide and one or more urea compounds having one or more urea groups and a molecular weight per urea group of up to 250;
(iii) one or more toughening agents; and
(iv) 0.1 to 5 wt % zinc oxide nanoparticles, wherein the zinc oxide nanoparticles have an average particle size of from 10 nm to 100 nm,
(b) contacting a second substrate with the first substrate; and
(c) curing the one-component epoxy resin adhesive composition to form an adhesive bond between the first and second substrates.
 
14. The method according to claim 9, wherein the first substrate is a metal substrate and the second substrate is a metal substrate having a zinc-containing layer thereon.