CPC C09J 163/00 (2013.01) [C08K 3/22 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01)] | 14 Claims |
9. A method comprising:
(a) applying a one-component epoxy resin adhesive composition to at least a portion of a one substrate, wherein the one-component epoxy resin adhesive composition comprises:
(i) one or more non-rubber-modified epoxy resins;
(ii) one or more latent epoxy curing agents, wherein the one or more latent epoxy curing agents comprises a dicyanamide and one or more urea compounds having one or more urea groups and a molecular weight per urea group of up to 250;
(iii) one or more toughening agents; and
(iv) 0.1 to 5 wt % zinc oxide nanoparticles, wherein the zinc oxide nanoparticles have an average particle size of from 10 nm to 100 nm,
(b) contacting a second substrate with the first substrate; and
(c) curing the one-component epoxy resin adhesive composition to form an adhesive bond between the first and second substrates.
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14. The method according to claim 9, wherein the first substrate is a metal substrate and the second substrate is a metal substrate having a zinc-containing layer thereon.
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