US 11,674,040 B2
Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure
Kenji Ota, Ichihara (JP)
Assigned to DOW TORAY CO., LTD., Tokyo (JP)
Appl. No. 16/633,452
Filed by DOW TORAY CO., LTD., Tokyo (JP)
PCT Filed Jul. 11, 2018, PCT No. PCT/JP2018/026226
§ 371(c)(1), (2) Date Apr. 11, 2020,
PCT Pub. No. WO2019/021824, PCT Pub. Date Jan. 31, 2019.
Claims priority of application No. JP2017-142709 (JP), filed on Jul. 24, 2017.
Prior Publication US 2020/0239758 A1, Jul. 30, 2020
Int. Cl. C08L 83/04 (2006.01); C08K 3/22 (2006.01); H01M 10/613 (2014.01); H01M 10/655 (2014.01); C09K 5/14 (2006.01); H05K 7/20 (2006.01); C08K 3/04 (2006.01); C08K 5/5415 (2006.01); C08K 9/06 (2006.01); C08K 3/38 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01)
CPC C08L 83/04 (2013.01) [C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 5/5415 (2013.01); C08K 9/06 (2013.01); C09K 5/14 (2013.01); H01M 10/613 (2015.04); H01M 10/655 (2015.04); H05K 7/2039 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08K 2003/385 (2013.01); C08L 2201/08 (2013.01); C08L 2205/025 (2013.01)] 20 Claims
 
1. A thermally conductive silicone gel composition comprising:
(A) 100 parts by mass of an alkenyl group-containing organopolysiloxane having a viscosity of from 10 to 100,000 mPa·s at 25° C.;
(B1) a straight-chain organohydrogenpolysiloxane containing an average of 2 silicon-bonded hydrogen atoms only in the side chain of the molecular chain and having a viscosity of from 1 to 1,000 mPa·s at 25° C.;
(non-B) an organohydrogenpolysiloxane other than component (B1);
(C) a catalytic amount of a hydrosilylation reaction catalyst;
(D) 400 to 3,500 parts by mass of a thermally conductive filler;
(E) 0.1 to 2.0 mass % of an alkoxysilane having an alkyl group with 6 or more carbon atoms per molecule with respect to component (D); and
(F) a heat resistance imparting agent;
wherein the total amount of silicon-bonded hydrogen atoms in components (B1) and (non-B) is from 0.2 to 5 mol per 1 mol of an alkenyl group contained in component (A);
wherein component (non-B) is an organohydrogenpolysiloxane selected from the group consisting of:
i) copolymers of methylhydrogensiloxane and dimethylsiloxane capped at both ends of the molecular chain by trimethylsiloxy groups, having on average more than 4 silicon-bonded hydrogen atoms per molecule; and
ii) copolymers of methylhydrogensiloxane and dimethylsiloxane capped at both ends of the molecular chain by dimethylhydrogensiloxy groups, having on average more than 4 silicon-bonded hydrogen atoms per molecule;
wherein the content of silicon-bonded hydrogen atoms in component (B1) ([HB]) and the content of silicon-bonded hydrogen atoms in organohydrogenpolysiloxane(s) other than component (B1) ([Hnon-B]) in the composition, that is the value of [Hnon-B]/([HB]+[Hnon-B]), is in the range of greater than 0.0 to 0.70; and
wherein component (D) is: (D1) a lamellar boron nitride powder having an average particle size of 0.1 to 30 μm; (D2) a granular boron nitride powder having an average particle size of 0.1 to 50 μm; (D3) a spherical and/or crushed aluminum oxide powder having an average particle size of 0.01 to 50 μm; (D4) a graphite having an average particle size of 0.01 to 50 μm; or a mixture of two or more of these.