CPC B81C 1/00158 (2013.01) [H01L 41/35 (2013.01); B81C 2201/013 (2013.01)] | 25 Claims |
1. A method of processing a wafer having a first side and a second side opposite to one another to manufacture an oscillating structure, comprising:
a) forming first and second elastic torsional elements which are constrained to respective portions of a fixed supporting body and define an axis of rotation;
b) forming a mobile element interposed between, and connected to, said first and second elastic torsional elements, the mobile element being rotatable about the axis of rotation as a consequence of a torsion of the first and second elastic torsional elements;
c) processing the first side of said wafer at the mobile element to form a mechanical reinforcement structure for the mobile element, by:
c1) growing a reinforcement layer on the first side of the wafer; and
c2) patterning said reinforcement layer by removing selective portions of the reinforcement layer; and
d) processing the second side of said wafer, including carrying out, at the second side of the wafer, at least one of: chemical etching, deposition of metal material, and deposition of piezoelectric material;
wherein step d) is performed after performing step c).
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