	US 11,673,353 B2
	High-energy density nanocomposite capacitor
Andrew Sherman, Mentor, OH (US); Haixong Tang, Euclid, OH (US); and Brian Doud, Cleveland Heights, OH (US)
Assigned to POWDERMET INC., Euclid, OH (US)
Filed by Powdermet, Inc., Euclid, OH (US)
Filed on Mar. 3, 2020, as Appl. No. 16/807,996.
Application 16/807,996 is a division of application No. 15/294,936, filed on Oct. 17, 2016, granted, now 10,647,071.
Claims priority of provisional application 62/243,394, filed on Oct. 19, 2015.
Prior Publication US 2020/0376785 A1, Dec. 3, 2020
Int. Cl. H01B 3/12 (2006.01); B29C 70/60 (2006.01); H01M 4/04 (2006.01); H01B 1/12 (2006.01); B29C 70/88 (2006.01); B29C 43/24 (2006.01); B29C 48/00 (2019.01); B29C 39/22 (2006.01); C08J 5/00 (2006.01); B29C 49/00 (2006.01); B29C 55/28 (2006.01); C08K 3/22 (2006.01); C08K 9/02 (2006.01); B29C 39/00 (2006.01); H01M 4/64 (2006.01); H01G 4/32 (2006.01); H01G 4/20 (2006.01); H01G 4/18 (2006.01); H01G 4/30 (2006.01); C08K 3/00 (2018.01); C04B 35/00 (2006.01); B29C 39/02 (2006.01); B29C 55/04 (2006.01); B29C 55/12 (2006.01); B29K 105/16 (2006.01); B29K 509/02 (2006.01); B29L 31/34 (2006.01); H01G 4/12 (2006.01); H01G 4/33 (2006.01)

CPC B29C 70/60 (2013.01) [B29C 39/003 (2013.01); B29C 39/22 (2013.01); B29C 43/24 (2013.01); B29C 48/022 (2019.02); B29C 49/0005 (2013.01); B29C 55/28 (2013.01); B29C 70/882 (2013.01); C08J 5/005 (2013.01); C08K 3/22 (2013.01); C08K 9/02 (2013.01); H01B 1/12 (2013.01); H01M 4/04 (2013.01); B29C 39/02 (2013.01); B29C 55/04 (2013.01); B29C 55/12 (2013.01); B29K 2105/162 (2013.01); B29K 2509/02 (2013.01); B29K 2995/0006 (2013.01); B29L 2031/34 (2013.01); C04B 35/00 (2013.01); C08K 3/00 (2013.01); C08K 2201/011 (2013.01); H01G 4/1227 (2013.01); H01G 4/18 (2013.01); H01G 4/186 (2013.01); H01G 4/206 (2013.01); H01G 4/306 (2013.01); H01G 4/32 (2013.01); H01G 4/33 (2013.01); H01M 4/64 (2013.01)]

30 Claims

1. A composite film comprising a polymer material and a plurality of particles of dielectric permittivity ceramic filler; said dielectric permittivity ceramic filler having a core-shell structure; a core of said core-shell structure having a different composition than a shell of said core-shell structure; said core includes ceramic material that includes two or more materials selected from the group consisting of barium, calcium, copper, lead, magnesium, strontium, niobium, titanium, and zirconium; at least one portion of said dielectric permittivity ceramic filler formed of cores that have been sintered at a first temperature and another portion of said dielectric permittivity ceramic filler formed of cores that have been sintered at a second temperature, and wherein said first and second temperatures are different temperatures; said shell formed of one or more materials selected from the group consisting of Al₂O₃, SiO₂, Si₃N₄, MgO, aluminosilicate, mica, and carbon; at least one portion of said dielectric permittivity ceramic filler is formed of cores wherein said ceramic material has been doped to include one or more elements selected from the group consisting of Nd, Ca, Mn, and/or Y.