US 11,673,226 B2
Retaining ring for CMP
Andrew J. Nagengast, Sunnyvale, CA (US); Christopher Heung-Gyun Lee, San Jose, CA (US); Thomas Li, Santa Clara, CA (US); Anand N. Iyer, Cupertino, CA (US); Jie Diao, Fremont, CA (US); Huanbo Zhang, San Jose, CA (US); Erik S. Rondum, San Ramon, CA (US); Wei-Cheng Lee, Los Altos Hills, CA (US); and Jeonghoon Oh, Saratoga, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 7, 2019, as Appl. No. 16/435,302.
Application 16/435,302 is a continuation of application No. 15/658,294, filed on Jul. 24, 2017, granted, now 10,322,492.
Claims priority of provisional application 62/366,550, filed on Jul. 25, 2016.
Prior Publication US 2019/0291238 A1, Sep. 26, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 37/32 (2012.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC B24B 37/32 (2013.01) [H01L 21/30625 (2013.01); H01L 21/67063 (2013.01); H01L 21/67092 (2013.01); H01L 21/68735 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A retaining ring, comprising:
a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface, the bottom surface having a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel, and the recessed region and the remainder of the channel each have substantially uniform depth.