US 11,672,168 B2
Ligand for surface modification, light emitting element including the same, and method for manufacturing display device
YunKu Jung, Cheonan-si (KR); YunHyuk Ko, Asan-si (KR); HyoJin Ko, Seoul (KR); DukKi Kim, Suwon-si (KR); JunBo Sim, Suwon-si (KR); and JaeKook Ha, Seoul (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Apr. 5, 2021, as Appl. No. 17/222,901.
Claims priority of application No. 10-2020-0058822 (KR), filed on May 18, 2020.
Prior Publication US 2021/0359229 A1, Nov. 18, 2021
Int. Cl. H01L 51/00 (2006.01); C07F 7/08 (2006.01); C07F 9/38 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01)
CPC H01L 51/0094 (2013.01) [C07F 7/0834 (2013.01); C07F 9/3817 (2013.01); H01L 51/005 (2013.01); H01L 51/5237 (2013.01); H01L 51/56 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light emitting element comprising:
a member including a semiconductor layer and an active layer; and
at least one ligand bonded to a surface of the member;
wherein the at least one ligand comprises:
a first ligand including two or more functional group chains; and
a second ligand having a shorter carbon length than the first ligand.