US 11,672,148 B2
Display device and method for manufacturing the same
Shunpei Yamazaki, Tokyo (JP); Masakatsu Ohno, Tochigi (JP); Hiroki Adachi, Tochigi (JP); Satoru Idojiri, Tochigi (JP); and Koichi Takeshima, Tochigi (JP)
Assigned to Semiconductor Energy Laboratory Co., Ltd., Atsugi (JP)
Filed by SEMICONDUCTOR ENERGY LABORATORY CO., LTD., Atsugi (JP)
Filed on May 4, 2021, as Appl. No. 17/307,088.
Application 17/307,088 is a continuation of application No. 16/872,806, filed on May 12, 2020, granted, now 11,004,925.
Application 16/872,806 is a continuation of application No. 16/856,139, filed on Apr. 23, 2020, granted, now 10,872,947, issued on Dec. 22, 2020.
Application 16/856,139 is a continuation of application No. 16/204,102, filed on Nov. 29, 2018, granted, now 10,854,697, issued on Dec. 1, 2020.
Application 16/204,102 is a continuation of application No. 15/894,117, filed on Feb. 12, 2018, granted, now 10,355,067, issued on Jul. 16, 2019.
Application 15/894,117 is a continuation of application No. 15/416,166, filed on Jan. 26, 2017, granted, now 10,312,315, issued on Jun. 4, 2019.
Application 15/416,166 is a continuation of application No. 15/145,246, filed on May 3, 2016, granted, now 9,559,316, issued on Jan. 31, 2017.
Application 15/145,246 is a continuation of application No. 14/553,251, filed on Nov. 25, 2014, granted, now 9,437,831, issued on Sep. 6, 2016.
Claims priority of application No. 2013-249631 (JP), filed on Dec. 2, 2013; application No. 2013-256872 (JP), filed on Dec. 12, 2013; application No. 2013-272176 (JP), filed on Dec. 27, 2013; and application No. 2014-047348 (JP), filed on Mar. 11, 2014.
Prior Publication US 2021/0257432 A1, Aug. 19, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/00 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); H01L 51/52 (2006.01); H01L 27/12 (2006.01); H01L 29/24 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); B23K 26/0622 (2014.01); B23K 26/04 (2014.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); H01L 51/50 (2006.01); H01L 41/314 (2013.01)
CPC H01L 27/3272 (2013.01) [B23K 26/04 (2013.01); B23K 26/0617 (2013.01); B23K 26/0622 (2015.10); B23K 26/0643 (2013.01); B23K 26/0648 (2013.01); B23K 26/083 (2013.01); H01L 27/1225 (2013.01); H01L 27/1266 (2013.01); H01L 27/322 (2013.01); H01L 27/3258 (2013.01); H01L 27/3262 (2013.01); H01L 29/24 (2013.01); H01L 29/66969 (2013.01); H01L 29/7869 (2013.01); H01L 29/78603 (2013.01); H01L 51/003 (2013.01); H01L 51/0024 (2013.01); H01L 51/0027 (2013.01); H01L 51/0097 (2013.01); H01L 51/5246 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 27/3244 (2013.01); H01L 41/314 (2013.01); H01L 51/5096 (2013.01); H01L 51/5284 (2013.01); H01L 2227/323 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01); Y02E 10/549 (2013.01); Y02P 70/50 (2015.11)] 16 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first flexible substrate;
a first bonding layer over the first flexible substrate;
a first organic resin layer over the first bonding layer;
an insulating layer over the first organic resin layer;
a transistor over the insulating layer;
an organic electroluminescent element electrically connected to the transistor;
a touch sensor over the organic electroluminescent element;
a second organic resin layer over the organic electroluminescent element;
a second bonding layer over the second organic resin layer; and
a second flexible substrate over the second bonding layer,
wherein a thickness of the first organic resin layer is less than or equal to 20 μm, and
wherein at least a part of the electronic device is curved.