US 11,672,109 B2
Component evaluation method, electrical characteristic measurement method, component packaging machine, and machine dedicated to electrical characteristic measurement
Mitsuhiko Shibata, Toyota (JP)
Assigned to FUJI CORPORATION, Chiryu (JP)
Appl. No. 16/334,518
Filed by FUJI CORPORATION, Chiryu (JP)
PCT Filed Sep. 20, 2016, PCT No. PCT/JP2016/077625
§ 371(c)(1), (2) Date Mar. 19, 2019,
PCT Pub. No. WO2018/055658, PCT Pub. Date Mar. 29, 2018.
Prior Publication US 2020/0084929 A1, Mar. 12, 2020
Int. Cl. H05K 13/08 (2006.01); H05K 13/04 (2006.01); H05K 13/00 (2006.01)
CPC H05K 13/082 (2018.08) [H05K 13/0069 (2013.01); H05K 13/0409 (2018.08); H05K 13/0419 (2018.08); H05K 13/0882 (2018.08)] 7 Claims
OG exemplary drawing
 
1. A component evaluation method, comprising:
providing a component tape holding a plurality of components held side by side in a longitudinal direction on the component tape;
providing a mounting and placement sequence for the plurality of components, the mounting and placement sequence including mounting information for performing mounting work on a circuit board, and placement information for placing a group of components among the plurality of components on an electrical characteristic measurement device provided in the component mounting machine, the group of components being based on a number of the plurality of components and a variable, and including a component positioned at a leading end of the component tape and a component positioned in a middle of the component tape;
reading a next piece of information in the mounting and placement sequence;
when the next piece of information in the mounting and placement sequence is the mounting information, performing the mounting work of picking up and carrying the component corresponding to the next piece of information in the mounting and placement sequence so as to be mounted on the circuit board by moving a suction nozzle based on the mounting information in the mounting and placement sequence;
when the next piece of information in the mounting and placement sequence is the placement information, moving the component corresponding to the next piece of information in the mounting and placement sequence to the electrical characteristic measurement device and measuring electrical characteristics of the component corresponding to the next piece of information in the mounting and placement sequence using the electrical characteristic measurement device; and
performing statistical processing on measured values of the electrical characteristics of the group of components.