CPC H05K 7/20336 (2013.01) [C25D 7/0678 (2013.01); F28D 15/046 (2013.01); B32B 15/20 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2307/302 (2013.01); B32B 2311/12 (2013.01)] | 13 Claims |
1. A method for manufacturing a heat equalization plate, comprising:
providing a copper-clad laminate comprising a copper foil;
laminating a photoresist layer on a side of the copper foil to cover the copper foil;
exposing and developing the photoresist layer to form an outer opening and a plurality of inner openings to expose a part of the first copper foil, wherein the outer opening is an annulus and surrounds the plurality of inner openings;
forming a thermally conductive bump in each of the plurality of inner openings by electroplating, and forming a connecting bump in the outer opening by electroplating, wherein the connecting bump surrounds a plurality of thermally conductive bumps, each of the plurality of thermally conductive bump and the connecting bump is electrically connected to the copper foil;
removing the photoresist layer to obtain an intermediate structure;
stacking and connecting two intermediate structures to form a sealed chamber and filling a working fluid in the sealed chamber after vacuumizing the sealed chamber, wherein two connecting bumps facing and corresponding to each other are connected, thereby forming the sealed chamber between two intermediate structures.
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