CPC H05K 5/0213 (2013.01) [H01L 23/053 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H01L 23/4093 (2013.01); H05K 5/0221 (2013.01); H01L 2924/0002 (2013.01)] | 20 Claims |
1. A semiconductor package comprising:
a housing having an interior portion configured for housing a semiconductor device that is on a semiconductor substrate;
a first side of the semiconductor package extending from the housing;
a second side of the semiconductor package extending from the housing and disposed substantially parallel to the first side;
a first attachment clip having a first end attached to the first side with a first section of the first attachment clip adjacent to the first side, the first attachment clip having a second end attached to the second side with a second section of the first attachment clip adjacent to the second side, the first attachment clip having a central region; and
a first loop in the first attachment clip, the first loop including a first portion of the first attachment clip that extends in a first direction upward away from a plane of the first section of the first attachment clip wherein the first portion continues to extend in a second direction back downward to substantially the plane of the first section of the first attachment clip and wherein all of the first loop is external to both the first side and the second side.
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