CPC H05K 1/0243 (2013.01) [H01Q 1/241 (2013.01); H04R 1/1016 (2013.01); H04R 1/1033 (2013.01); H04R 2420/07 (2013.01)] | 27 Claims |
1. A wireless earphone for receiving audio content over a wireless communication channel at a desired frequency spectrum, the wireless earphone comprising:
a multi-layer printed circuit board (PCB);
an antenna assembly comprising a wire antenna, wherein the wire antenna has a wire length compatible with the desired frequency spectrum, comprises a first end, and is characterized by an antenna radiation resistance and wherein the first end is inserted through a through-hole of the multi-layer PCB; and
an impedance matching interface utilizing a PCB specific radio frequency (RF) VIA geometry having an electrical interaction between the first end of the wire antenna and at least one PCB layer of the multi-layer PCB to provide a distributed impedance matching, wherein the wireless earphone is at least partially matched to an antenna impedance.
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