US 11,672,078 B2
Antenna application in wireless earphones
Christopher Zachara, Williamsburg, VA (US); Truong Vu Luu, Morton Grove, IL (US); and Christopher Richard Knipstein, Chicago, IL (US)
Assigned to Shure Acquisition Holdings, Inc., Niles, IL (US)
Filed by Shure Acquisition Holdings, Inc., Niles, IL (US)
Filed on Jun. 10, 2021, as Appl. No. 17/344,110.
Claims priority of provisional application 63/038,972, filed on Jun. 15, 2020.
Prior Publication US 2021/0392741 A1, Dec. 16, 2021
Int. Cl. H05K 1/02 (2006.01); H01Q 1/24 (2006.01); H04R 1/10 (2006.01)
CPC H05K 1/0243 (2013.01) [H01Q 1/241 (2013.01); H04R 1/1016 (2013.01); H04R 1/1033 (2013.01); H04R 2420/07 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A wireless earphone for receiving audio content over a wireless communication channel at a desired frequency spectrum, the wireless earphone comprising:
a multi-layer printed circuit board (PCB);
an antenna assembly comprising a wire antenna, wherein the wire antenna has a wire length compatible with the desired frequency spectrum, comprises a first end, and is characterized by an antenna radiation resistance and wherein the first end is inserted through a through-hole of the multi-layer PCB; and
an impedance matching interface utilizing a PCB specific radio frequency (RF) VIA geometry having an electrical interaction between the first end of the wire antenna and at least one PCB layer of the multi-layer PCB to provide a distributed impedance matching, wherein the wireless earphone is at least partially matched to an antenna impedance.