US 11,671,950 B2
Communication apparatus and communication method
Toru Oizumi, Kanagawa (JP); Daichi Imamura, Kanagawa (JP); Akihiko Nishio, Osaka (JP); and Hidetoshi Suzuki, Kanagawa (JP)
Assigned to Sun Patent Trust, New York, NY (US)
Filed by Sun Patent Trust, New York, NY (US)
Filed on Feb. 23, 2021, as Appl. No. 17/182,662.
Application 17/182,662 is a continuation of application No. 16/854,640, filed on Apr. 21, 2020, granted, now 10,973,024.
Application 16/854,640 is a continuation of application No. 16/453,763, filed on Jun. 26, 2019, granted, now 10,667,261, issued on May 26, 2020.
Application 16/453,763 is a continuation of application No. 16/109,300, filed on Aug. 22, 2018, granted, now 10,375,692, issued on Aug. 6, 2019.
Application 16/109,300 is a continuation of application No. 15/592,023, filed on May 10, 2017, granted, now 10,085,257, issued on Sep. 25, 2018.
Application 15/592,023 is a continuation of application No. 15/250,679, filed on Aug. 29, 2016, granted, now 9,716,570, issued on Jul. 25, 2017.
Application 15/250,679 is a continuation of application No. 14/874,114, filed on Oct. 2, 2015, granted, now 9,461,781, issued on Oct. 4, 2016.
Application 14/874,114 is a continuation of application No. 14/114,705, granted, now 9,184,896, issued on Nov. 10, 2015, previously published as PCT/JP2012/004246, filed on Jun. 29, 2012.
Claims priority of application No. 2011-154890 (JP), filed on Jul. 13, 2011; and application No. 2012-015257 (JP), filed on Jan. 27, 2012.
Prior Publication US 2021/0176750 A1, Jun. 10, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H04W 72/0446 (2023.01); H04W 72/23 (2023.01); H04L 1/1829 (2023.01); H04L 5/00 (2006.01); H04W 88/02 (2009.01); H04W 84/04 (2009.01)
CPC H04W 72/0446 (2013.01) [H04L 1/1854 (2013.01); H04L 1/1861 (2013.01); H04L 5/001 (2013.01); H04L 5/0085 (2013.01); H04W 72/23 (2023.01); H04W 84/042 (2013.01); H04W 88/02 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An integrated circuit comprising:
circuitry, which, in operation, controls:
receiving a higher layer signaling that indicates a reference configuration pattern that is a reference uplink/downlink (UL/DL) configuration, which is one of a plurality of configuration patterns, each configuration pattern defining allocation of one or more first uplink subframe(s) and one or more first downlink subframe(s) within a frame;
receiving a downlink signaling for determining a configuration pattern for a component carrier;
determining, if the downlink signaling is received, the configuration pattern for the component carrier according to the received downlink signaling, wherein when the determined configuration pattern is different from the reference UL/DL configuration, the reference UL/DL configuration defines the allocation of the one or more first uplink subframe(s) that are inclusive of one or more second uplink subframes defined by the determined configuration pattern, and the reference UL/DL configuration defines at least one more uplink subframe than defined by the determined configuration pattern; and
transmitting an uplink signal on an uplink subframe of the component carrier, the uplink subframe being one of the one or more second uplink subframes defined by the determined configuration pattern.