US 11,671,763 B2
Parylene electret condenser microphone backplate
Benjamin Jay Grigg, Chicago, IL (US); and Donald D. Noettl, Chicago, IL (US)
Assigned to Shure Acquisition Holdings, Inc., Niles, IL (US)
Filed by Shure Acquisition Holdings, Inc., Niles, IL (US)
Filed on Feb. 24, 2021, as Appl. No. 17/184,338.
Prior Publication US 2022/0272460 A1, Aug. 25, 2022
Int. Cl. H04R 19/01 (2006.01); H04R 1/04 (2006.01); H04R 7/04 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01); B05D 1/00 (2006.01)
CPC H04R 19/016 (2013.01) [H04R 1/04 (2013.01); H04R 7/04 (2013.01); H04R 19/04 (2013.01); H04R 31/006 (2013.01); B05D 1/60 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A microphone assembly comprising:
a housing having a top and a bottom, the housing further comprising:
a flexible diaphragm located above a backplate assembly; and
a spacer intermediate the diaphragm and backplate assembly, the spacer creating an air gap between the diaphragm and backplate;
wherein the backplate assembly is coupled to the housing and further comprises:
a body comprising:
a diameter;
a top side; and
a bottom side;
wherein a coating of vapor-deposited electret material coats the top side of the body;
wherein the body has a flatness deviation across the diameter of the body configured to help prevent the diaphragm from collapsing onto the backplate assembly; and
wherein the coating of vapor-deposited electret material comprises parylene-AF4.