CPC H04R 19/016 (2013.01) [H04R 1/04 (2013.01); H04R 7/04 (2013.01); H04R 19/04 (2013.01); H04R 31/006 (2013.01); B05D 1/60 (2013.01)] | 21 Claims |
1. A microphone assembly comprising:
a housing having a top and a bottom, the housing further comprising:
a flexible diaphragm located above a backplate assembly; and
a spacer intermediate the diaphragm and backplate assembly, the spacer creating an air gap between the diaphragm and backplate;
wherein the backplate assembly is coupled to the housing and further comprises:
a body comprising:
a diameter;
a top side; and
a bottom side;
wherein a coating of vapor-deposited electret material coats the top side of the body;
wherein the body has a flatness deviation across the diameter of the body configured to help prevent the diaphragm from collapsing onto the backplate assembly; and
wherein the coating of vapor-deposited electret material comprises parylene-AF4.
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