US 11,671,072 B2
Multi-layer piezoelectric substrate with conductive layer
Rei Goto, Osaka (JP); and Keiichi Maki, Suita (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Dec. 20, 2019, as Appl. No. 16/723,819.
Claims priority of provisional application 62/785,011, filed on Dec. 26, 2018.
Prior Publication US 2020/0212883 A1, Jul. 2, 2020
Int. Cl. H03H 9/02 (2006.01); H03H 9/13 (2006.01); H03H 9/64 (2006.01); H03H 9/54 (2006.01); H03H 3/08 (2006.01); H03H 9/72 (2006.01); H10N 30/05 (2023.01); H10N 30/50 (2023.01); H10N 30/87 (2023.01)
CPC H03H 9/02913 (2013.01) [H03H 3/08 (2013.01); H03H 9/02559 (2013.01); H03H 9/02574 (2013.01); H03H 9/02834 (2013.01); H03H 9/131 (2013.01); H03H 9/54 (2013.01); H03H 9/6406 (2013.01); H03H 9/725 (2013.01); H10N 30/05 (2023.02); H10N 30/50 (2023.02); H10N 30/87 (2023.02)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave device comprising:
a piezoelectric layer over a substrate;
an interdigital transducer electrode over the piezoelectric layer;
a conductive layer positioned between the piezoelectric layer and the substrate;
a grounding structure positioned under the substrate such that the substrate is positioned between the conductive layer and the grounding structure, the conductive layer being electrically connected to the grounding structure; and
an insulating layer disposed at least partially between the piezoelectric layer and the conductive layer.