US 11,670,857 B2
Antenna apparatus
Won Cheol Lee, Suwon-si (KR); Nam Ki Kim, Suwon-si (KR); Jae Min Keum, Suwon-si (KR); and Jeong Ki Ryoo, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed on Sep. 13, 2021, as Appl. No. 17/473,214.
Application 17/473,214 is a continuation of application No. 16/672,888, filed on Nov. 4, 2019, granted, now 11,158,948.
Claims priority of application No. 10-2019-0031892 (KR), filed on Mar. 20, 2019; and application No. 10-2019-0069810 (KR), filed on Jun. 13, 2019.
Prior Publication US 2021/0408687 A1, Dec. 30, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 9/04 (2006.01); H01Q 5/335 (2015.01); H01Q 5/40 (2015.01)
CPC H01Q 9/045 (2013.01) [H01Q 5/335 (2015.01); H01Q 5/40 (2015.01); H01Q 9/0414 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An antenna apparatus comprising:
a first patch antenna pattern comprising a through-hole disposed at an offset from a center of the first patch antenna pattern;
a second patch antenna pattern disposed above the first patch antenna pattern and spaced apart from the first patch antenna pattern;
a first feed via electrically connected to the first patch antenna pattern;
a second feed via penetrating through the through-hole of the first patch antenna pattern;
a plurality of shielding vias surrounding the second feed via;
a plurality of dummy vias disposed between the first feed via and the second feed via; and
a feed pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feed via, and another end connected to the second patch antenna pattern at a point closer to an edge of the second patch antenna pattern than the second feed via.