CPC H01L 29/401 (2013.01) [H01L 29/0653 (2013.01); H01L 29/423 (2013.01); H01L 29/7823 (2013.01)] | 20 Claims |
1. A method for eliminating divot formation, comprising:
forming an isolation layer;
forming a conduction layer which has an upper inclined boundary with the isolation layer such that the conduction layer has a portion located above a portion of the isolation layer at the upper inclined boundary;
etching back the isolation layer; and
etching back the conduction layer after etching back the isolation layer such that a top surface of the etched conduction layer is located at a level lower than a top surface of the etched isolation layer.
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