CPC H01L 27/14636 (2013.01) [H01L 27/14607 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01); H01L 31/036 (2013.01)] | 20 Claims |
1. An image sensing integrated chip, comprising:
a semiconductor substrate having sidewalls defining one or more trenches on opposing sides of a region of the semiconductor substrate;
one or more dielectrics disposed within the one or more trenches;
wherein the semiconductor substrate comprises a plurality of flat surfaces arranged within a pixel region that is laterally between the one or more trenches, adjacent ones of the plurality of flat surfaces defining a plurality of triangular shaped protrusions and alternative ones of the plurality of flat surfaces being substantially parallel to one another, as viewed along a cross-sectional view; and
wherein outermost ones of the plurality of flat surfaces arranged along a periphery of the pixel region extend vertically past inner ones of the plurality of flat surfaces within a central part of the pixel region, as viewed along the cross-sectional view.
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