US 11,670,618 B2
System-in-package with double-sided molding
DeokKyung Yang, Incheon Si (KR); YongMin Kim, Incheon-si (KR); JaeHyuk Choi, Incheon (KR); YeoChan Ko, Incheon (KR); and HeeSoo Lee, Kyunggi-do (KR)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Sep. 1, 2020, as Appl. No. 17/8,918.
Application 17/008,918 is a continuation of application No. 16/826,169, filed on Mar. 21, 2020, granted, now 10,797,024.
Application 16/826,169 is a continuation of application No. 15/458,649, filed on Mar. 14, 2017, granted, now 10,636,765, issued on Apr. 28, 2020.
Prior Publication US 2020/0402955 A1, Dec. 24, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 23/552 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01)
CPC H01L 25/0655 (2013.01) [H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/566 (2013.01); H01L 21/6835 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 25/0652 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 21/486 (2013.01); H01L 22/14 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H01L 23/5384 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/11901 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/81466 (2013.01); H01L 2224/81484 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15312 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/3025 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A method of making a semiconductor device, comprising:
providing a substrate including an opening formed through the substrate;
disposing the substrate in a mold; and
depositing an encapsulant into the mold, wherein the encapsulant flows through the opening.