CPC H01L 24/29 (2013.01) [H01L 21/565 (2013.01); H01L 23/3157 (2013.01); H01L 23/481 (2013.01); H01L 24/27 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/14 (2013.01)] | 20 Claims |
1. An integrated circuit assembly, comprising:
a first reconstituted assembly comprising at least one passive component and a first bonding layer, wherein the at least one passive component comprises at least one of a capacitor, a varactor, an inductor, or a resistor;
a second reconstituted assembly disposed above the first reconstituted assembly and comprising one or more first semiconductor dies, a second bonding layer bonded to the first bonding layer of the first reconstituted assembly, and a third bonding layer; and
a third reconstituted assembly disposed above the second reconstituted assembly and comprising one or more second semiconductor dies and a fourth bonding layer bonded to the third bonding layer of the second reconstituted assembly.
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