US 11,670,607 B2
Electronic package
Chih-Hsien Chiu, Taichung (TW); Wen-Jung Tsai, Taichung (TW); and Chia-Chu Lai, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONW ARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Apr. 19, 2021, as Appl. No. 17/233,885.
Claims priority of application No. 110105521 (TW), filed on Feb. 18, 2021.
Prior Publication US 2022/0262747 A1, Aug. 18, 2022
Int. Cl. H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 9/04 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 24/16 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/242 (2013.01); H01Q 9/0414 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3025 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a carrier structure having a circuit layer;
an electronic element disposed on the carrier structure and electrically connected to the circuit layer; and
an antenna structure disposed on the carrier structure and comprising a base portion configured with an antenna body and at least a first support portion disposed on the base portion, wherein the base portion is disposed over the carrier structure through the first support portion and at least an open area is formed between the base portion and the carrier structure, and wherein the antenna body has at least an antenna layer arranged on the base portion and at least an antenna extension portion embedded in the first support portion for electrically connecting the antenna layer and the circuit layer.