CPC H01L 23/427 (2013.01) [H01L 21/4871 (2013.01); H01L 21/52 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0655 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/1443 (2013.01)] | 20 Claims |
1. An electronic device comprising:
a substrate;
at least one electronic element on the substrate;
a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein; and
a bracket covering the substrate, the at least one electronic element and the heat dissipating pad, the bracket directly contacting the substrate and the heat dissipating pad.
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