US 11,670,531 B2
Bridge pick-up head for transferring semiconductor devices
Oscar Torrents Abad, Cork (IE); Daniel Brodoceanu, Cork (IE); Ali Sengül, Zurich (CH); and Pooya Saketi, Cork (IE)
Assigned to Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed by Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed on Nov. 13, 2019, as Appl. No. 16/682,545.
Claims priority of provisional application 62/838,868, filed on Apr. 25, 2019.
Prior Publication US 2020/0343121 A1, Oct. 29, 2020
Int. Cl. H01L 21/68 (2006.01); H01L 21/683 (2006.01); B65G 47/90 (2006.01); H01L 33/00 (2010.01)
CPC H01L 21/683 (2013.01) [B65G 47/90 (2013.01); H01L 33/00 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A system, comprising:
a target substrate; and
a pick-up tool (PUT), including:
a first leg portion and a second leg portion;
a bridge base portion between the first leg portion and the second leg portion, the bridge base portion compressed when a force is applied on a semiconductor device; and
a tip protruding away from the bridge base portion, the tip configured to attach with the semiconductor device and place the semiconductor device on the target substrate, the first and second leg portions contacting the target substrate when the semiconductor device is placed on the target substrate, the bridge base portion and the tip apply the force on the semiconductor device toward the target substrate, the first and second leg portions extend below the tip when the bridge base portion is compressed to adhere with the target substrate and hold the semiconductor device to a target location on the target substrate, the tip extending below the first and second leg portions when the bridge base portion is uncompressed.