CPC H01L 21/683 (2013.01) [B65G 47/90 (2013.01); H01L 33/00 (2013.01)] | 16 Claims |
1. A system, comprising:
a target substrate; and
a pick-up tool (PUT), including:
a first leg portion and a second leg portion;
a bridge base portion between the first leg portion and the second leg portion, the bridge base portion compressed when a force is applied on a semiconductor device; and
a tip protruding away from the bridge base portion, the tip configured to attach with the semiconductor device and place the semiconductor device on the target substrate, the first and second leg portions contacting the target substrate when the semiconductor device is placed on the target substrate, the bridge base portion and the tip apply the force on the semiconductor device toward the target substrate, the first and second leg portions extend below the tip when the bridge base portion is compressed to adhere with the target substrate and hold the semiconductor device to a target location on the target substrate, the tip extending below the first and second leg portions when the bridge base portion is uncompressed.
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