US 11,670,524 B2
Fully automated wafer debonding system and method thereof
Cheng-Fei Yu, Hsin-Chu (TW); Chang-Chen Tsao, Hsin-Chu (TW); Ting-Yau Shiu, Hsin-Chu (TW); Cheng-Kang Hu, Kaohsiung (TW); Hsu-Shui Liu, Pingjhen (TW); and Jiun-Rong Pai, Jhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Dec. 2, 2020, as Appl. No. 17/110,122.
Claims priority of provisional application 62/968,363, filed on Jan. 31, 2020.
Prior Publication US 2021/0242043 A1, Aug. 5, 2021
Int. Cl. H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); B32B 43/00 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/02032 (2013.01) [B32B 43/006 (2013.01); H01L 21/02079 (2013.01); H01L 21/67092 (2013.01); H01L 22/12 (2013.01); H01L 24/799 (2013.01); H01L 24/98 (2013.01); B32B 2457/14 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A debonding system for debonding a pair of bonded wafers, comprising:
a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck;
a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers,
wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers; and
at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.