US 11,670,521 B2
Reliable semiconductor packages for sensor chips
Il Kwon Shim, Singapore (SG); and Jeffrey Punzalan, Singapore (SG)
Assigned to UTAC Headquarters Pte. Ltd, Singapore (SG)
Filed by UTAC Headquarters Pte. Ltd., Singapore (SG)
Filed on Dec. 17, 2020, as Appl. No. 17/125,995.
Claims priority of provisional application 62/950,128, filed on Dec. 19, 2019.
Prior Publication US 2021/0193483 A1, Jun. 24, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/60 (2006.01)
CPC H01L 21/561 (2013.01) [H01L 23/31 (2013.01); H01L 24/14 (2013.01); H01L 24/94 (2013.01); H01L 2021/60097 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A device comprising:
a package substrate having top and bottom major package substrate surfaces, the top major package substrate surface includes a die attach region;
a die having a second major die surface attached to the die attach region, the die comprises an image sensor die, wherein a first major die surface of the die includes a sensor region with an image sensor and a cap bond region surrounding the sensor region;
a cap standoff structure on the cap bond region, wherein the cap standoff structure comprises
a continuous cap adhesive ring disposed on the first major die surface of the die in the cap bond region surrounding the sensor region, and
discontinuous rigid spacers distributed completely within the continuous cap adhesive ring, wherein the discontinuous rigid spacers each comprises a discontinuous metallic stud disposed on a dummy bond pad, the discontinuous rigid spacers are non-electrically functional rigid spacers;
active die bond pads disposed on the first major die surface in the cap bond region, the active bond pads include wire bonds coupled to package bond pads on the top major package substrate surface; and
a transparent protective cover attached to the cap standoff structure by the continuous cap adhesive ring, the transparent protective cover forms a cavity over the sensor region, and wherein the discontinuous rigid spacers within the continuous cap adhesive ring maintains a height of the cavity (cavity height) between the transparent protective cover and the first major die surface at least at about a predefined height.