US 11,670,459 B2
Multilayer capacitor and board having the same mounted thereon
Sim Chung Kang, Suwon-si (KR); Yong Park, Suwon-si (KR); Woo Chul Shin, Suwon-si (KR); and Ki Pyo Hong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 18, 2021, as Appl. No. 17/529,848.
Application 17/529,848 is a continuation of application No. 16/858,827, filed on Apr. 27, 2020, granted, now 11,309,132.
Claims priority of application No. 10-2019-0100294 (KR), filed on Aug. 16, 2019.
Prior Publication US 2022/0076893 A1, Mar. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A multilayer capacitor comprising:
a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having a first surface and a second surface opposing each other, a third surface and a fourth surface, connected to the first surface and the second surface, opposing each other, and a fifth surface and a sixth surface, connected to the third surface and the fourth surface, opposing each other, the first internal electrode being in contact with the third, fifth, and sixth surfaces, and the second internal electrode being in contact with the fourth, fifth, and sixth surfaces;
a first side portion and a second side portion disposed on the fifth surface and the sixth surface of the capacitor body, respectively; and
a first external electrode and a second external electrode, respectively disposed to the third surface and the fourth surface of the capacitor body to respectively be connected to the first internal electrode and the second internal electrode,
wherein the first side portion and the second side portion comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P),
wherein the dielectric layer has an average thickness of 0.4 μm or less, and
wherein a content of aluminum (Al) and silicon (Si) of each of the first and second side portions is twice or more that of aluminum (Al) and silicon (Si) in the capacitor body.