US 11,670,452 B2
Multilayer electronic component
Chung Hyeon Ryu, Suwon-si (KR); Gi Sub Lee, Suwon-si (KR); and Ah Young Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 16, 2021, as Appl. No. 17/403,161.
Claims priority of application No. 10-2020-0149845 (KR), filed on Nov. 11, 2020.
Prior Publication US 2022/0148804 A1, May 12, 2022
Int. Cl. H01G 4/012 (2006.01); H01G 4/008 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01)
CPC H01G 4/012 (2013.01) [H01G 4/0085 (2013.01); H01G 4/30 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and internal electrodes alternately stacked with one of the dielectric layers interposed therebetween; and
external electrodes disposed on external surfaces of the body and connected to the internal electrodes,
wherein one of the internal electrodes includes a plurality of conductive particles and conductive nanowires, the conductive nanowires having a shape different from a shape of the plurality of conductive particles and being connected to at least one of the plurality of conductive particles,
the conductive nanowires comprise a conductive metal,
a length of one of the conductive nanowires is 10 μm or more.