US 11,670,437 B2
Assembly and method for sealing a bundle of wires
Sunny Sethi, Castro Valley, CA (US); Vijay Daga, Sunnyvale, CA (US); Kavitha Bharadwaj, Fremont, CA (US); and Ting Gao, Palo Alto, CA (US)
Assigned to TE Connectivity Solutions GmbH, Schaffhausen (CH)
Filed by TE CONNECTIVITY SERVICES GMBH, Schaffhausen (CH)
Filed on Jan. 12, 2022, as Appl. No. 17/574,261.
Application 17/574,261 is a continuation of application No. 16/046,577, filed on Jul. 26, 2018, granted, now 11,257,612.
Prior Publication US 2022/0139597 A1, May 5, 2022
Int. Cl. H01B 7/285 (2006.01); H02G 15/013 (2006.01); H01B 13/00 (2006.01); H01B 3/30 (2006.01); H01B 3/44 (2006.01)
CPC H01B 13/0016 (2013.01) [H01B 3/305 (2013.01); H01B 3/441 (2013.01); H01B 3/446 (2013.01); H01B 13/0036 (2013.01); H01B 7/285 (2013.01); H01B 13/0013 (2013.01); H02G 15/013 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure for creating a sealed wire bundle comprising:
a first adhesive material in the form of a circular or semi-circular shape, the first adhesive material having a first outer wall, the first adhesive material having a first viscosity;
first wire receiving spaces;
first spoke arms extend inward from the first outer wall, the first wire receiving spaces are provided between the first spoke arms;
wherein wires are positioned in the first wire receiving spaces;
wherein as heat is applied to the structure, the first adhesive material flows to fill voids between the plurality of wires to thereby seal the wires.