US 11,669,472 B2
Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package
Lai Guan Tang, Tanjung Bungah (MY); Ankireddy Nalamalpu, Portland, OR (US); Dheeraj Subbareddy, Portland, OR (US); Chee Hak Teh, Bayan Lepas (MY); and Md Altaf Hossain, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 6, 2021, as Appl. No. 17/543,433.
Application 17/543,433 is a continuation of application No. 16/726,132, filed on Dec. 23, 2019, granted, now 11,216,397.
Prior Publication US 2022/0092009 A1, Mar. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 13/20 (2006.01); G06F 13/40 (2006.01)
CPC G06F 13/20 (2013.01) [G06F 13/4027 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a plurality of die;
an active interposer coupled to the plurality of die, wherein the active interposer comprises translation circuitry configured to:
receive data from a first die of the plurality of die using a first frequency;
translate, inside the active interposer, the data received using the first frequency to a second frequency associated with a second die of the plurality of die, the second die being coupled to the active interposer; and
transmit the translated data to the second die with the second frequency.