US 11,669,175 B2
Electronic equipment
Yukinori Hayashi, Okayama (JP)
Assigned to Susa Inc., Okayama (JP)
Filed by Susa Inc., Okayama (JP)
Filed on Dec. 11, 2020, as Appl. No. 17/118,764.
Claims priority of application No. JP2019-226956 (JP), filed on Dec. 17, 2019; and application No. JP2020-145152 (JP), filed on Aug. 31, 2020.
Prior Publication US 2021/0191535 A1, Jun. 24, 2021
Int. Cl. G06F 3/0354 (2013.01); H05K 5/02 (2006.01); H05K 1/11 (2006.01)
CPC G06F 3/03541 (2013.01) [H05K 1/118 (2013.01); H05K 5/0213 (2013.01)] 24 Claims
OG exemplary drawing
 
11. An electronic equipment which can be used in medical settings where a sterilization treatment by a high temperature and high pressure steam in an autoclave equipment is applied, the electronic equipment comprising:
a housing; and
a substrate which is arranged in an internal space of the housing and on which an electronic circuit component is mounted,
wherein the substrate is arranged so as to be separated from a bottom portion of the housing upward in a Z direction by a distance K1 corresponding to a distance between a lower surface of the bottom portion of the housing and a lower surface of the electronic circuit component in the Z direction and/or by a distance K2 corresponding to a distance between an upper surface of the bottom portion of the housing and a lower surface of the substrate in the Z direction,
the substrate is separated from an outer surface of an upper portion of the housing by a distance K3 corresponding to a distance between an upper surface of the electronic circuit component and the outer surface of the upper portion of the housing in the Z direction,
the electronic circuit component is separated from a lower side surface of the upper portion of the housing by a distance K4A corresponding to a distance between a center of the electronic circuit component and the lower side surface of the upper portion of the housing in a Y direction,
the center of the electronic circuit component in a transverse direction is separated from the lower side surface of the upper portion of the housing by a distance K4B in a transverse direction of the housing,
the substrate is separated from the outer surface of the upper portion of the housing by a distance K4C1 corresponding to a distance from one end surface of the substrate in a longitudinal direction to the outer surface of the upper portion of the housing on one side in the Y direction and by a distance K4C2 corresponding to a distance from the other end surface of the substrate in the longitudinal direction to the outer surface of the upper portion of the housing on the other side in the Y direction, respectively,
as separation distances of the substrate in an X direction orthogonal to the Y direction of a horizontal direction, the substrate is separated from the outer surface of the upper portion of the housing by a distance K4D1 corresponding to a distance from one side surface of the substrate in a transverse direction to the outer surface of the upper portion of the housing of the electronic equipment on one side in the transverse direction and by a distance K4D2 corresponding to a distance from the other side surface of the substrate in the transverse direction to the outer surface of the upper portion of the housing of the electronic equipment on the other side in the transverse direction, respectively,
the substrate is separated from the outer surface of the upper portion of the housing by a distance K5 corresponding to a distance between one end portion of the substrate and the outer surface of the upper portion of the housing closest to the one end portion, and
the electronic circuit component and the optical element or the imaging element are arranged so as to be separated from each other in the horizontal direction and a vertical direction.