CPC G05B 19/41875 (2013.01) [H01L 22/12 (2013.01); H05H 1/46 (2013.01); G05B 2219/45031 (2013.01)] | 21 Claims |
1. A method of evaluating tool health of a plasma tool, the method comprising:
providing a classification model that identifies a plurality of failure modes of the plasma tool;
performing an initial test on an incoming wafer by performing a measurement on the incoming wafer;
determining that the incoming wafer meets a preset requirement based on the initial test, in response to determining that the incoming wafer meets a preset requirement based on the initial test, executing a plasma etching process, and predicting a wafer characteristic associated with the plasma etching process using a virtual metrology (VM) model that is configured to predict the wafer characteristic based on parameters measured by module sensors and in-situ sensors of the plasma tool;
determining that the wafer characteristic predicted by using the VM model is outside a pre-determined range and identifying a current failure mode using the classification model; and
based on the current failure mode, adjusting a recipe of the plasma etching process or taking a corrective action for the plasma tool.
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