US 11,669,033 B2
Heating device with a heat conductor including portions having different thicknesses
Kazuhiko Kikuchi, Yokohama Kanagawa (JP); Sasuke Endo, Chigasaki Kanagawa (JP); Masaya Tanaka, Sunto Shizuoka (JP); Ryota Saeki, Sunto Shizuoka (JP); Kiyotaka Murakami, Mishima Shizuoka (JP); Kousei Miyashita, Sunto Shizuoka (JP); Ryosuke Kojima, Sunto Shizuoka (JP); Yohei Doi, Mishima Shizuoka (JP); Yuki Kawashima, Tagata Shizuoka (JP); and Eiji Shinohara, Mishima Shizuoka (JP)
Assigned to Toshiba Tec Kabushiki Kaisha, Tokyo (JP)
Filed by TOSHIBA TEC KABUSHIKI KAISHA, Tokyo (JP)
Filed on Mar. 16, 2022, as Appl. No. 17/696,786.
Application 17/696,786 is a continuation of application No. 17/242,205, filed on Apr. 27, 2021, granted, now 11,307,522.
Application 17/242,205 is a continuation of application No. 16/880,935, filed on May 21, 2020, granted, now 11,106,164, issued on Aug. 31, 2021.
Claims priority of application No. JP2019-159395 (JP), filed on Sep. 2, 2019.
Prior Publication US 2022/0206422 A1, Jun. 30, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G03G 15/20 (2006.01)
CPC G03G 15/2053 (2013.01) [G03G 15/2064 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A heating device, comprising:
a rotatable film;
a heater including:
a substrate that extends along a first direction and has two surfaces opposite to each other, and
a heater element on one of the surfaces of the substrate; and
a heat conductor having first and second surfaces and including:
a first portion contacting the other surface of the substrate, and
a second portion that is adjacent to the first portion in a second direction perpendicular to the first direction and does not contact the other surface of the substrate, wherein
a thickness of the first portion of the heat conductor from the first surface to the second surface is greater than a thickness of the second portion from the first surface to the second surface.