US 11,667,839 B2
Low oxide trench dishing chemical mechanical polishing
Xiaobo Shi, Chandler, AZ (US); Krishna P. Murella, Phoenix, AZ (US); Joseph D. Rose, Gilbert, AZ (US); Hongjun Zhou, Chandler, AZ (US); and Mark Leonard O'Neill, Queen Creek, AZ (US)
Assigned to Versum Materials US, LLC, Tempe, AZ (US)
Filed by Versum Materials US, LLC, Tempe, AZ (US)
Filed on Jun. 22, 2021, as Appl. No. 17/354,311.
Application 17/354,311 is a division of application No. 16/450,784, filed on Jun. 24, 2019, granted, now 11,078,417.
Claims priority of provisional application 62/692,639, filed on Jun. 29, 2018.
Claims priority of provisional application 62/692,633, filed on Jun. 29, 2018.
Prior Publication US 2021/0324270 A1, Oct. 21, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. C09K 13/00 (2006.01); C09K 13/02 (2006.01); C09K 13/06 (2006.01); H01L 21/3105 (2006.01)
CPC C09K 13/00 (2013.01) [C09K 13/02 (2013.01); C09K 13/06 (2013.01); H01L 21/31053 (2013.01)] 9 Claims
OG exemplary drawing
 
9. The chemical mechanical polishing composition of claim 1, wherein the composition comprises one selected from the group consisting of from 0.0001 wt. % to 0.05 wt. % of the biocide having active ingredient selected from the group consisting of 5-chloro-2-methyl-4-isothiazolin-3-one, 2-methyl-1-isothiazolin-3-one, and combinations thereof; from 0 wt. % to 1 wt. % of the pH adjusting agent selected from the group consisting of nitric acid, hydrochloric acid, sulfuric acid, phosphoric acid, other inorganic or organic acids, and mixtures thereof for acidic pH conditions; or selected from the group consisting of sodium hydride, potassium hydroxide, ammonium hydroxide, tetraalkyl ammonium hydroxide, organic quaternary ammonium hydroxide compounds, organic amines, and combinations thereof for alkaline pH conditions; and combinations thereof.