CPC C09K 11/025 (2013.01) [H01L 51/502 (2013.01); H01L 51/56 (2013.01); B82Y 20/00 (2013.01); B82Y 40/00 (2013.01)] | 19 Claims |
1. A method of manufacturing a light emitting element, the method comprising:
forming a first electrode;
forming a hole transport region on the first electrode;
forming an emission layer on the hole transport region;
forming an electron transport region on the emission layer; and
forming a second electrode on the electron transport region,
wherein the forming of the emission layer comprises:
providing a quantum dot composition, comprising a quantum dot and a ligand bonded to a surface of the quantum dot, to form a preliminary emission layer; and
increasing a layer density of the preliminary emission layer by about 5% or greater, and
wherein the ligand comprises:
a head portion bonded to the surface of the quantum dot; and a tail portion comprising at least one radical reactive group,
a head portion bonded to the surface of the quantum dot; a connecting portion connected to the head portion and comprising a metal; and a tail portion coordinated to the metal of the connecting portion, or
a head portion bonded to the surface of the quantum dot and comprising an ion bond material or a polar solvent dissociative functional group; and a tail portion connected to the head portion.
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