	US 11,667,821 B2
	One-component adhesive compositions
Michael E. O'Brien, Hainesville, IL (US); Warren A. Kaplan, Libertyville, IL (US); and Jennifer S. Westfall, Bethel Park, PA (US)
Assigned to STEPAN COMPANY, Northfield, IL (US)
Filed by STEPAN COMPANY, Northfield, IL (US)
Filed on Jun. 15, 2021, as Appl. No. 17/348,199.
Application 17/348,199 is a continuation of application No. PCT/US2019/066592, filed on Dec. 16, 2019.
Claims priority of provisional application 62/893,407, filed on Aug. 29, 2019.
Claims priority of provisional application 62/782,020, filed on Dec. 19, 2018.
Prior Publication US 2021/0309895 A1, Oct. 7, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. C09J 163/04 (2006.01); C08G 59/42 (2006.01); C08G 59/62 (2006.01); C09J 163/00 (2006.01)

CPC C09J 163/04 (2013.01)

17 Claims

1. A process for making a one-component (1K) adhesive, the process comprising reacting a mixture which comprises:

(a) a polyepoxide compound having an equivalent weight within the range of 125 to 250 g/eq.;

(b) a composition comprising:

(i) a polyester polyol having a hydroxyl value within the range of 100 to 250 mg KOH/g, an average hydroxyl functionality within the range of 1.5 to 4.0, and an acid number less than 5 mg KOH/g; and

(ii) a polyether polyol having a hydroxyl value within the range of 28 to 800 mg KOH/g and an average hydroxyl functionality within the range of 2.7 to 8.0;

and

at a temperature within the range of 100° C. to 220° C. for a time effective to cure the adhesive, wherein the ratio of epoxy equivalents of the polyepoxide compound to hydroxyl equivalents of the polyol composition is within the range of 2.5:1 to 3.5:1.