US 11,667,519 B2
Semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit
Alessandro Tocchio, Milan (IT); and Lorenzo Corso, Ruginello (IT)
Assigned to STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed by STMICROELECTRONICS S.R.L., Agrate Brianza (IT)
Filed on Feb. 1, 2021, as Appl. No. 17/164,546.
Application 17/164,546 is a division of application No. 16/240,415, filed on Jan. 4, 2019, granted, now 10,934,158.
Application 16/240,415 is a division of application No. 15/452,424, filed on Mar. 7, 2017, granted, now 10,202,275, issued on Feb. 12, 2019.
Claims priority of application No. 102016000083804 (IT), filed on Aug. 9, 2016.
Prior Publication US 2021/0155472 A1, May 27, 2021
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01)
CPC B81B 7/007 (2013.01) [B81C 1/00246 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/092 (2013.01); B81B 2207/096 (2013.01); B81C 2201/0132 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0136 (2013.01); B81C 2203/0771 (2013.01); B81C 2203/0792 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated inertial sensor, comprising:
a substrate including semiconductor material;
a microelectromechanical system (MEMS) structure at a first surface of the substrate, the MEMS structure including a suspended inertial mass;
an application-specific integrated circuit (ASIC) electronic circuit electrically coupled to the MEMS structure, at a second surface of the substrate, and opposite to the first surface in a direction transverse to respective planes of extension of the first surface and the second surface;
electrically conductive interconnection structures extending through the substrate and having a first end at the first surface and a second end at the second surface, the interconnection structures electrically coupling the MEMS structure to the ASIC electronic circuit, and each interconnection structure includes a conductive connection portion surrounded by an insulation structure that electrically insulates the conductive connection portion from the substrate, the insulation structure has a ring conformation and includes a conductive core and an insulating coating that encloses the conductive core and electrically insulates the conductive core from the conductive connection portion, the conductive core and insulating coating together forming an insulation capacitor that electrically insulates the conductive connection portion from the substrate;
a covering coupled to the MEMS structure; and
a supporting layer coupled to the covering.