US 11,667,128 B2
Fluidic die with monitoring circuit fault protection structure
Eric Martin, Corvallis, OR (US); Terry McMahon, Corvallis, OR (US); and Donald W Schulte, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/46,877
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed May 15, 2018, PCT No. PCT/US2018/032763
§ 371(c)(1), (2) Date Oct. 12, 2020,
PCT Pub. No. WO2019/221706, PCT Pub. Date Nov. 21, 2019.
Prior Publication US 2021/0146695 A1, May 20, 2021
Int. Cl. B41J 2/175 (2006.01); H01L 23/62 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H03K 17/687 (2006.01)
CPC B41J 2/17566 (2013.01) [H01L 23/62 (2013.01); H01L 27/092 (2013.01); H01L 29/0619 (2013.01); B41J 2002/17579 (2013.01); H03K 17/6871 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A fluidic die comprising:
a plurality of fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a high voltage; and
monitoring circuitry, operating at a low voltage relative to the fluid actuator, to monitor a condition of each fluid chamber, for each chamber the monitoring circuitry including:
a connection structure; and
a select transistor and a pulldown transistor connected to the electrode via the connection structure, the connection structure and select and pulldown transistors together structured to form electrically conductive paths with electrical resistances to protect at least the select transistor from fault damage if the high voltage fluid actuator short-circuits to the electrode.