US 11,667,007 B2
Polishing apparatus and polishing method
Mitsunori Sugiyama, Tokyo (JP); Taro Takahashi, Tokyo (JP); and Yoichi Kobayashi, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Oct. 17, 2018, as Appl. No. 16/162,914.
Claims priority of application No. JP2017-202620 (JP), filed on Oct. 19, 2017.
Prior Publication US 2019/0118332 A1, Apr. 25, 2019
Int. Cl. B24B 37/013 (2012.01); B24B 37/12 (2012.01); B24B 49/12 (2006.01); B24B 57/02 (2006.01); B24B 49/08 (2006.01); B24B 37/10 (2012.01); B24B 37/20 (2012.01); B24B 27/00 (2006.01); H01L 21/306 (2006.01)
CPC B24B 37/013 (2013.01) [B24B 27/0023 (2013.01); B24B 37/105 (2013.01); B24B 37/12 (2013.01); B24B 37/205 (2013.01); B24B 49/08 (2013.01); B24B 49/12 (2013.01); B24B 57/02 (2013.01); H01L 21/30625 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A polishing apparatus configured to perform polishing between a polishing pad and a polishing object disposed opposite to the polishing pad, comprising:
a rotatable polishing table configured to hold the polishing pad;
a rotatable holding unit configured to hold the polishing object;
a swing arm holding the holding unit;
an arm drive section configured to swing the swing arm around a center of swinging on the swing arm during the polishing;
a measuring unit disposed on the polishing table, and configured to measure a physical quantity of the polishing object changeable in accordance with a change in film thickness of the polishing object;
a controller comprising:
a distance determining section configured to determine a distance from an axis of rotation when the polishing object is rotated by the holding unit, to the measuring unit at the time of measurement by the measuring unit, when the polishing object is swung around the center of swinging on the swing arm and rotated by the holding unit; and
an end point detection section configured to detect a polishing end point indicating an end of the polishing based on the physical quantity measured by the measuring unit and the determined distance.
 
7. A polishing method for performing polishing between a polishing pad and a polishing object disposed opposite to the polishing pad, the method comprising:
holding the polishing pad to a polishing table and rotating the polishing table;
holding the polishing object to a holding unit and rotating the holding unit;
holding the holding unit using a swing arm and causing the swing arm to swing around a center of swinging on the swing arm during the polishing;
measuring a physical quantity of the polishing object changeable in accordance with a change in film thickness of the polishing object using a measuring unit disposed on the polishing table;
determining a distance from an axis of rotation when the polishing object is rotated by the holding unit, to the measuring unit at the time of measurement by the measuring unit, when the polishing object is swung around the center of swinging on the swing arm and rotated by the holding unit; and
detecting a polishing end point indicating an end of the polishing based on the measured physical quantity and the determined distance.